Most soldering problems stem from either not enough temperature or unclean metal surfaces, or both.
The required temperature needs to be in the item being soldered, tag, wire, whatever. Applying a hot iron and solder to a cold or unclean piece of metal just results in a blob of solder sitting there, barely attached. This means a big enough, hot enough, iron to heat the bit of metal in the area where soldering is to happen BEFORE THE HEAT TRAVELS TO A PLACE WHERE IT IS UNWANTED.
A poor joint in a low power part of the system just gives uncertain operation. A poor joint in a place where high current is expected makes a spot where power is converted into heat, possibly more than the surroundings can handle. That's the fire risk of a bad join, quite apart from the circuit not working reliably.